This is the sensor board for the HEP (vacuum implementation) of the SCI640DNW test setup. As such, this sensor board is in vacuum. It has the following features:
- LCC socket on the board houses the packaged SCI640DNW chip.
- I/O signals are brought to a Molex Pico-Clasp connector on the sensor board by a vacuum-side cable. The vacuum-side cable mates to the vacuum-flange MDM, and to the sensor board Pico-Clasp connector.
- HV power supplies are brought to a Nano-Fit connector on the sensor board. (These HV power supplies cannot be brought in through the Pico-Clasp.)